Name: EPYC 9684X - 2.55 GHz - 96 Kerne - 1
Brand: AMD
SKU: 47822087
Price: 10144 CHF
Availability: InStock

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The AMD EPYC 9684X is a powerful processor designed for demanding computing applications. With a base clock frequency of 2.55 GHz and the ability to reach up to 3.7 GHz in turbo mode, this processor delivers impressive performance for server and data center environments. The architecture of the EPYC 9684X supports 96 cores and 192 threads, enabling high parallel processing and enhancing efficiency in executing multithreaded applications. The processor is equipped with a generous 1152 MB L3 cache, further optimizing data processing speed. The EPYC 9684X uses the SP5 socket and supports the latest DDR5 memory with a transfer rate of up to 4800 MT/s, making it a future-proof choice for modern IT infrastructures. With a maximum thermal design power (TDP) of 400 watts, this processor is designed for use in high-performance servers that demand significant computing power.

- 96 cores and 192 threads for high parallel processing
- Dodeca-channel memory architecture for improved bandwidth
- Supports DDR5 SDRAM with speeds of up to 4800 MHz
- 1152 MB L3 cache for optimized data processing
- Maximum turbo clock frequency of 3.7 GHz for additional performance.

Actual product image AMD EPYC 9684X - 2.55 GHz - 96 Kerne - 1 (SP5, 2.55 GHz, 96 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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